Take a look at the ISO 26262 to Semiconductors Conference Agenda, taking place on the 11-14 June 2019, in Detroit, USA. Here you will learn about ISO/PAS21448 and the safety of the intended functionality, Practical application of ISO26262 part 11, cost optimized strategies for FuSa, and OEM, Tier1, & Tier2 expectations of Semiconductors.
ISO 26262 Part 11 has been developed for semiconductors, however semiconductor companies face critical obstacles regarding high integrity levels of security while continually trying to reduce SoC time to market, offer value and remain cost efficient. How can semiconductor companies prepare to overcome these challenges?
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